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Step stencils: two thicknesses in one foil

When one board needs more paste in some places and less in others, one thickness cannot do both. Here is how step stencils work and when they earn their cost.

A step stencil carries two (or more) foil thicknesses in one piece: thin where fine-pitch parts need less paste, thicker where connectors, power pads or through-hole joints need more. It lets a mixed-technology board print correctly in a single pass instead of compromising with one thickness or running two stencils.

Step-up and step-down, in plain words

A step-down stencil starts from a thicker base and is thinned locally over the fine-pitch area — this is the most common type. A step-up starts from a thinner base and is thickened locally over the parts that need more paste, such as a large connector or a ceramic BGA. Both are machined into the foil — usually on the squeegee side, so the foil can still sit flat on the board — and both can be combined on one stencil if a board calls for it.

When a board needs one

The typical triggers are:

  • Fine-pitch SMD parts (0.4 mm pitch or below) sharing a board with large through-hole joints that demand extra paste.
  • Connectors, coils or ceramic BGAs that need a locally higher paste volume than the rest of the board allows.
  • Raised features such as press-fit pins, tall vias or clamps that need a pocket so the foil does not rock on the board.
  • Pin-in-paste assemblies, where through-hole parts are soldered with paste printed through the stencil.

What changes in the design

Stepping is a real machining operation, so the design rules matter. Practical guidance from the IPC-7525 family and common shop practice: keep apertures clear of the step boundary — around 1.5–2 mm of clearance is the usual floor — and keep the step depth modest, with ΔT ≤ 0.5 × base thickness as the usual upper bound and 0.05 mm a common practical limit. Rectangular steps aligned with the squeegee travel are the most forgiving. Tell us where the thin and thick zones must be; we will check the clearances and come back if anything needs to move.

How we quote a step stencil

Because the price depends on your actual layout, a step stencil is quoted from the Gerber file rather than from a list. To quote it in the first reply, we need six things: step-up or step-down; how many stepped areas; the area of each; the base and stepped thicknesses; which side is machined; and the surface finish. Send the file with those answers and we will price it, usually within the same working day.

When a single thickness is enough

Not every mixed board needs stepping. If the finest pitch still prints cleanly at the thickness the large joints want — and our thickness guide helps you estimate that — a standard stencil is simpler, cheaper and more consistent to print. Stepping is the tool for boards where that compromise does not exist.

FAQ

Common questions

How much more does a step stencil cost?

It is quoted per project rather than from a price list, because the machining depends on your layout — how many stepped areas, their size, and the depths involved. Send us the Gerber with the six details above and the price comes back with the quotation, usually within the same working day.

Can I just order a second stencil instead?

You can — some shops run one stencil for fine pitch and one for the heavy joints. It works, but it means two print passes, two alignments and two chances for misprint on every board. A step stencil costs more than one standard stencil and replaces two of them, and it prints once.

Are there limits on how deep a step can be?

Yes. The usual guidance from IPC-7525 is that the total thickness difference should not exceed half the base foil thickness, with roughly 0.025–0.05 mm as the practical working range. Deeper steps stress the foil at the boundary. If your process seems to need more, the layout usually has a better answer — tell us and we will look at it with you.

Can step stencils be framed and nano-coated?

Yes. Step foils can be supplied frameless or tensioned into a frame like any other stencil, and electropolishing or nano coating is applied after the step is machined. The finish actually helps here: smoother walls and a low-surface-energy coating both improve release in the thinned, fine-pitch zone.

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